Linkedin

WorkplanWork Package 5

WP5: Silicon photonics and CMOS integration

Leader: INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONIS

This work package will deal with the integration of the developed material technology in silicon photonics circuits and CMOS electronics to ensure automated, low-cost volume manufacturing of highly integrated and complex photonic devices. To this end, two functional demonstrators based on the key photonic components developed in WP3 and WP4 will be demonstrated to evaluate and validate the two material technologies addressed in SITOGA.

Image courtesy of FreeDigitalPhotosIconDrawer